Target gun for magnetron sputtering

MST series planar magnetron sputtering targets utilize MAXWELL simulation technology for optimized design of magnetic field distribution, magnetic circuit, water circuit, and electric field. This significantly improves target material utilization, power density, and sputtering efficiency. Widely used in magnetron sputtering coating equipment for metals and non-metals. Key features include: ● High target material utilization and high sputtering rate; Through magnetic field and node design, utilization rate is achieved above 35% while ensuring sputtering efficiency; Sputtering rate >100nm/min (two-inch target, copper target material) ● High power density and high heat dissipation rate; Utilizing a unique cooling water circuit and heat conduction structure design, improving heat transfer efficiency, power density can reach above 15W/cm² (cooling water pressure >0.3MPa).

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Glove box integrated magnetron sputtering coating machine

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Glove box integrated magnetron sputtering coating machine

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