Automated magnetron sputtering coating machine

MS-450 High Vacuum Multi-Target Magnetron Sputtering Coating Machine

Vacuum Chamber: Diameter 450 ✕ H400mm，1Cr18Ni9Ti High-quality stainless steel material, argon arc welding, front-opening structure;

Vacuum System: Mechanical Pump + Molecular Pump (Import and domestic optional);

Ultimate Vacuum: Better than 5 ✕ 10-5Pa (After baking degassing);

Vacuum Pumping Speed: Atmosphere ~ 8 ✕ 10-4Pa ≤ 30min；

Lifting Substrate Table: 2 ~ 6 inch substrate table, target-substrate distance 60 ~ 120mm Continuously online automatically adjustable, rotating 0 ~ 20r/min Adjustable, can be heated to 500 ℃ (Optional water cooling function), optional bias cleaning function;

Magnetron Target: Diameter 3 inch 2 ~ 4 only (can be upgraded to diameter 4 inch target 2 ~ 3 only), compatible with DC and RF, can sputter magnetic material targets;

Sputtering Power Supply: DC pulsed sputtering power supply, fully automatic matching RF sputtering power supply optional;

Mass Flow Meter: 2 ~ 3 Road process gas, can be increased according to process requirements;

Film Thickness Monitor: Optional domestic or imported single water-cooled probe film thickness meter;

Control Method: PLC+ Touch screen control system, with leak self-check and prompt, communication failure, realize one-button stop vacuum.